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Resilience Engineering
TU DelftTU EindhovenUniversity of TwenteWageningen University
Resilience Engineering


+31(0)6 48 27 55 61


Aaron Ding

I am leading the Cyber Physical Intelligence (CPI) Lab as tenured Associate Professor at TU Delft and Associate Professor (permanent) in Computer Science at University of Helsinki. My research focuses on edge computing, edge AI, and data-drive IoT services.

With over 16 years R&D practices in EU, Switzerland, UK and USA, I have worked at TU Munich with Jörg Ott, at University of Cambridge with Jon Crowcroft, at Columbia University with Henning Schulzrinne. I took my sabbatical at ETH Zürich with Adrian Perrig. My PhD is with Sasu Tarkoma (Helsinki) and Jon Crowcroft (Cambridge). Funded by the Nokia Foundation, vital part of my PhD programme is completed at University of Cambridge and Columbia University in New York City.

I have supervised 100+ students and won EU research grants (€5M+€4M) as Consortium Director & PI by leading a series of international and national R&D projects (H2020, Marie Curie ITN, German DAAD, EIT Digital, Tekes Finland) in tight collaboration with industrial companies of Nokia, Ericsson, Deutsche Telekom, Broadcom, Telia, NEC, Telefónica and WithSecure. For contributing to mobile edge computing with 90+ peer reviewed publications, I have received best paper awards & recognition from ACM SIGCOMM, ACM EdgeSys, ACM SenSys CCIoT, IEEE INFOCOM, TU Delft. I am a recipient of the esteemed Nokia Foundation Scholarship.

Being active internationally at ACM, IEEE and IETF, I am the founder of ACM EdgeSys, Associate Editor for ACM Transactions on Internet of Things (TIOT) and IEEE Journal of Intelligent Transportation Systems (OJ-ITS). As co-founder, I initiated the FCN series to promote collaborations between top European and Asian research institutes, including Cambridge, Helsinki, London, Amsterdam, Munich, Vienna, Tsinghua, Peking and Fudan.
I have been invited to serve on the programme and chairing committees for numerous top-tier international conferences, including ACM SIGCOMM, ACM MobiCom, ACM UbiComp, ACM WWW, ACM CoNEXT, ACM MobiSys, ACM/IEEE SEC, and IEEE INFOCOM.